Quasi-3D Thermal Modelling of Advanced Electronic Systems in Package
· 03.02.2024 · 07:00:44 ··· ··· Saturday ·· 6 (6)
Book Publisher International Quasi-3D Thermal Modelling of Advanced Electronic Systems in Package
View Book: https://doi.org/10.9734/bpi/taer/v3/2609G
#Quasi_3D_thermal_modelling #electronic_packages #chip_interconnection_technologies #chip_stacking_technology.
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