Driving decarbonization with COLD SPLIT technology
· 21.07.2023 · 09:00:01 ··· ··· Friday ·· 5 (5)
Infineon Technologies AG The race for the energy transition is happening now!
For a greener future #siliconcarbide (SiC) is one way to get more power out of less material.
👉 Our patented COLD SPLIT technology gives us the power to get more SiC wafers out of less material, while generating less waste. Traditionally SiC boules are cut into wafers by using a wire saw, where only 50% of the boule can be used later on as a wafer. COLD SPLT changes this.
💡 The SILTECTRA™ laser-based technique employs a chemical-physical process that uses thermal stress to generate a force that splits the material with exquisite precision – producing virtually no kerf loss.
▶️ Watch our video or check out our website on how we are driving decarbonization for a greener future with our innovative COLD SPLIT technology https://scom.ly/GP5Ggmd
____________
Do you like this video? Subscribe to Infineon on YouTube: https://www.youtube.com/channel/UCoTflChMPX0VBFXvXYmcu9w?sub_confirmation=1
Infineon is a world leader in semiconductor solutions that make life easier, safer and greener. Semiconductors are crucial to solve the energy challenges of our time and shape the digital transformation. This is why Infineon is committed to actively driving decarbonization and digitalization.
Connect with us on:
Twitter: https://twitter.com/Infineon
Facebook: https://www.facebook.com/Infineon
LinkedIn: https://www.linkedin.com/company/infineon-technologies
#semiconductors #microelectronics #Infineon
· 01.01.1970 · 01:00:00 ···
0**##
· 01.01.1970 · 01:00:00 ···
# · 01.01.1970 · 01:00:00 ···
* · 01.01.1970 · 01:00:00 ···
* · 01.01.1970 · 01:00:00 ···
********
